According to new rumors appeared in the global network, Huawei is
preparing to release a powerful flagship, whose thickness is only 6.3
mm. According to unofficial information, the device will be presented in
April. It is hard to say how reliable this information is, as the
current flagship smartphone - Huawei Ascend D2 - was announced about
three months ago and set up his rival now may be disadvantageous. On the
other hand, the new Huawei, is likely to come out to compete with the
Samsung Galaxy S4, the more that it should be more affordable. new
device, whose name is not specified, built on a processor HiSilicon K3V3
ARM Cortex A1 (Huawei development ) with Mali T604 GPU, equipped with 2
GB of RAM, 4,9-inch touch screen with a resolution of 1080p,
13-megapixel camera and a battery capacity of 2600 mAh. In this case, it
is not clear what it looks like this model - images or photos yet.
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